molding compound
EMC(EpoxyMoldingCompound)半導體等級封裝環氧樹酯.Definition&Features.Composition:EpoxyResin,Hardner,Filler(Silica),SomeAdditives,Moldcompoundsaretheplasticsusedtoencapsulatemanytypesofelectronicpackages,fromcapacitorsandtransistorstocentralprocess...
Molding Compound
- lead frame led
- QFP
- leadframe package
- lead frame中文
- QFP
- die attach
- lead frame製程
- lead frame鍍銀
- lead frame封裝
- leadframe process
- lead frame翻譯
- lead frame material
- leadframe材質
- leadframe package
- molding compound
- lead frame導線架
- qfn
- qfn
- Stamped lead frame
- leadframe製程
- 導線架廠商
- lead frame導線架
- flip chip on lead frame
- lead frame製程
- leadframe manufacturing
Inessence,themoldmaterialconsistsofsand,usuallysilicainaquartzform,clay,charcoalandwater.Atypicalcompositionforgreensandis:81wt% ...
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